Beth Keser

Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society. Provided by Wikipedia
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    Advances in embedded and fan-out wafer level packaging technologies

    Advances in embedded and fan-out wafer level packaging technologies

    Published 2019
    Other Authors: “…Keser, Beth, 1971-…”
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