Advances in embedded and fan-out wafer level packaging technologies

Advances in embedded and fan-out wafer level packaging technologies /

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging "FO-WLP" technologies have been developed across the industry over the...

Full description

Saved in:
Bibliographic Details
Online Access: Full text (MCPHS users only)
Other Authors: Keser, Beth, 1971- (Editor), Kroehnert, Steffen, 1970- (Editor)
Format: Electronic eBook
Language:English
Published: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019
Subjects:
Chip scale packaging.
Integrated circuits > Wafer-scale integration.
Local Note:ProQuest Ebook Central

Internet

Full text (MCPHS users only)

Similar Items